An epoxy resin composition and an epoxy resin molding material for sealing semiconductor are disclosed, the epoxy resin molding material containing the epoxy resin composition, the epoxy resin composition and the epoxy resin molding material achieving a good balance among heat resistance, peeling resistance, thermal shock resistance, moisture resistance reliability, and internal-stress relaxation. The present invention relates to an epoxy resin composition (C) for sealing semiconductor includes an epoxy resin (A) and a core-shell polymer (B) containing at least one rubber layer, at least 70% of the core-shell polymer (B) being dispersed in the form of primary particles in a resin phase containing the epoxy resin, and the content of alkali metal ions in the epoxy resin composition (C) being 30 ppm or less. An epoxy resin molding material containing the epoxy resin composition (C) is also provided ...
Source. Epoxy and resin are two similar materials that are often used interchangeably. Epoxy resins are polyepoxides that are reactive polymers and prepolymers. Different types of epoxy resins are Bisphenol-based epoxy resins and curing epoxy resins. Bisphenol-based epoxy resins are most used resin types across the globe. On the other hand, curing epoxy resins are the less used on an industrial level due to their poor mechanical properties, poor heat bearing properties, and not so good chemical properties. Different types of epoxy resins are now being used in various commercial and non-commercial applications such as construction, and decorative uses. Epoxy resins inherently have excellent adhesive and coating properties that make it a preferred choice over standard adhesives. Apart from being used as adhesives, epoxy resins are used in paints, primers, flooring, sealers, and coatings in product manufacturing and/or construction.. The global epoxy resin market is huge and it is growing with a ...
ACKNOWLEDGMENTS. The manuscript was supported by the Special Fund for Forest Scientific Research in the Public Welfare (20150452), the Fundamental Research Funds for the Central Universities (2572017EB06), and the National Natural Science Foundation of China (31670567).. REFERENCES CITED. Abenojar, J., Encinas, N., Real, J. C. D., and Martínez, M. A. (2014). "Polymerization kinetics of boron carbide/epoxy composites," Thermochimica Acta 575, 144-150. DOI: 10.1016/j.tca.2013.10.030. ASTM D 1084-16 (2016). "Standard test methods for viscosity of adhesives," ASTM International, West Conshohocken, PA.. ASTM D790-10 (2010). "Test methods for flexural properties of unreinforced and reinforced plastics and electrical insulating materials," ASTM International, West Conshohocken, PA.. ASTM D256-10 (2010). "Standard test methods for determining the Izod pendulum impact resistance of plastics," ASTM International, West Conshohocken, PA.. Cavdar, A. D., Kalaycioglu, H., and Hiziroglu, S. (2008). "Some of ...
This invention provides a process for producing an epoxy resin composition having core/shell rubber particles (rubber-like polymer particles) dispersed in an epoxy resin, wherein an epoxy resin composition excellent in the dispersed state of rubber-like polymer particles in an epoxy resin with a reduced amount of contaminants is produced easily and efficiently. The epoxy resin composition having rubber-like polymer particles dispersed well in an epoxy resin with less contaminant is obtained by bringing an aqueous latex of rubber-like polymer particles (B) into contact with an organic medium (C) showing partial solubility in water, then bringing an organic medium (D) having lower partial solubility in water than that of the organic medium (C) into contact therewith to separate water substantially, to remove the rubber-like polymer particles as a dispersion (F) having the polymer particles dispersed in the organic medium, and mixing it with an epoxy resin (A), followed by distilling volatile components
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0045] Examples of the epoxy resin may include, but are not limited to, bisphenol-based epoxy resins, ortho-cresol novolac-based epoxy resins, multi-functional epoxy resins, amine-based epoxy resins, heterocyclic epoxy resins, substituted epoxy resins, and naphthol-based epoxy resins. Examples of commercially available bisphenol-based epoxy resins may include, but are not limited to, E4275 (JAPAN EPOXY RESIN); Epiclon 830-S, Epiclon EXA-830CRP, Epiclon EXA 850-S, Epiclon EXA-835LV, etc. (Dainippon Ink and Chemicals, Inc.); Epicoat 807, Epicoat 815, Epicoat 825, Epicoat 827, Epicoat 828, Epicoat 834, Epicoat 1001, Epicoat 1004, Epicoat 1007, and Epicoat 1009 (Yuka Shell Epoxy Co., Ltd.); DER-330, DER-301, and DER-361, (Dow Chemical Co.); and YD-011, YDF-019, YD-128, YDF-170, etc. (Kukdo Chemical Co., Ltd.). Examples of commercially available ortho-cresol novolac-based epoxy resins may include, but are not limited to, YDCN-500-1P, YDCN-500-4P, YDCN-500-5P, YDCN-500-7P, YDCN-500-80P, and ...
0147]As epoxy resin, using YX-4000H (tetramethylbiphenol-type epoxy resin, epoxy equivalent: 195 g/eq) manufactured by Japan EpoxyResin Co., Ltd., NC-3000 (biphenylaralkyl type, epoxy equivalent: 277 g/eq) manufactured by Nippon Kayaku Co., Ltd. and N-665-EXP (cresol novolac type epoxy resin, epoxy equivalent: 203 g/eq) manufactured by Dainippon Ink and Chemicals, Inc., and the above-mentioned epoxy resin (b-1); as a curing agent, using phenol resins (a-1)-(a-5), (a-1) and Mirex XLC-3 L (phenolaralkyl resin, hydroxyl group equivalent: 176 g/eq) manufactured by Mitsui Chemicals, Inc.; these were combined with triphenylphosphine (TPP) as a curing accelerator, a condensed phosphoric acid ester (PX-200, manufactured by Daihachi. Chemical Industry Co., Ltd.) as a flame retardant, magnesium hydroxide (Z-10 manufactured by Air Water Co., Ltd.), a spheral fused silica (S-COL, manufactured by Micron Co., Ltd.) as an inorganic filler, γ-glycidoxy triethoxysilane (KBM-403, manufactured by Shin Etsu ...
The present invention relates to a two-component epoxy adhesive composition comprising a) a first component comprising a first epoxy resin and a second epoxy resin, the second epoxy resin being flexibilized by an elastomer, and b) a second component comprising at least one amine compound with one or more primary and/or secondary amino groups, said amine compound having a molecular weight of less than 450 g/mol. The ratio of the total number of amino groups of the amine compound to the total number of epoxy groups of the epoxy resins is 0.01:1 to 0.5:1. The mixing of the two components a) and b) results in a wash-off resistant composition. Said wash-off resistant composition results upon heat-curing in a crash-stable structural adhesive.
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The present invention provides an epoxy resin composition which is obtained by melt-mixing 100 parts by weight of an epoxy resin with 3 to 33 parts by weight of a thermoplastic resin alone or in combination with other components and additives than a hardener in the first mixing step and then with a hardener alone or in combination with other components and additives in the second mixing step, said epoxy resin having a number-average molecular weight of at least 200 and lower than 5000 and said thermoplastic resin having a number-average molecular weight of at least 5000; an adhesive epoxy resin molded article which is obtained by molding said epoxy resin composition; a process for producing an adhesive epoxy resin molded article which comprises molding said epoxy resin composition into a 0.01 to 10 mm thick film or sheet in a substantially uncured state and subsequently punching the film or sheet at temperatures higher than 15 C. and lower than 70 C.; and a process for performing bonding and sealing
Epoxy resin is widely used in high voltage apparatus as insulation. Fillers are often added to epoxy resin to enhance its mechanical, thermal and chemical properties. The addition of fillers can deteriorate electrical performance. With the new development in nanotechnology, it has been widely anticipated that the combination of nanoparticles with traditional resin systems may create nanocomposite materials with enhanced electrical, thermal and mechanical properties. In the present paper we have carried out a comparative study on dielectric properties, space charge and dielectric breakdown behavior of epoxy resin/nanocomposites with nano-fillers of SiO2 and Al2O3. The epoxy resin (LY556), commonly used in power apparatus was used to investigate the dielectric behavior of epoxy resin/nanocomposites with different filler concentrations. The epoxy resin/nanocomposite thin film samples were prepared and tests were carried out to measure their dielectric permittivity and tan delta value in a frequency ...
Epoxy resin is widely used in high voltage apparatus as insulation. Fillers are often added to epoxy resin to enhance its mechanical, thermal and chemical properties. The addition of fillers can deteriorate electrical performance. With the new development in nanotechnology, it has been widely anticipated that the combination of nanoparticles with traditional resin systems may create nanocomposite materials with enhanced electrical, thermal and mechanical properties. In the present paper we have carried out a comparative study on dielectric properties, space charge and dielectric breakdown behavior of epoxy resin/nanocomposites with nano-fillers of SiO2 and Al2O3. The epoxy resin (LY556), commonly used in power apparatus was used to investigate the dielectric behavior of epoxy resin/nanocomposites with different filler concentrations. The epoxy resin/nanocomposite thin film samples were prepared and tests were carried out to measure their dielectric permittivity and tan delta value in a frequency ...
Provided herein are a phenolic hydroxyl group-containing aromatic polyamide resin and a resin composition containing the resin, such as an epoxy resin composition containing an epoxy resin. The pheno
Curable epoxide resin mixtures based on adducts, containing epoxide groups, which are obtained by reaction of certain long-chain aliphatic polyesters with an excess of diepoxide compounds, and linear or slightly branched polyesters, containing carbocyclic or heterocyclic rings and possessing 3 or 4 terminal carboxyl groups, and having an average molecular weight of 600 - 6,000, 0.7 - 1.2 equivalents of carboxyl groups being present in the curable mixture per 1 equivalent of epoxide groups. Curing these epoxide resin mixtures gives flexible moulded materials which are distinguished by high tear propagation resistance.
An alkylsiloxane-containing epoxy resin composition can suitably be used as water-repellent agent or a water-repellent coating to be advantageously applied to areas that are apt to be brought into contact with solutions and substances containing one or more than one components that can damage the film forming property and the adhesion of an ordinary water-repellent agent. The resin composition comprises at least an alkylsiloxane-containing epoxy resin having two or more than two alkylsiloxane groups and two or more than two cyclic aliphatic epoxy groups in a molecule and a cationic polymerization catalyst.
Quasi-static and dynamic compression experiments were performed to study the influence of liquid nitrile rubber (LNBR) on the mechanical properties of epoxy resin. The quasi-static experiments were conducted by an electronic universal machine under strain rates of 0.0001/s and 0.001/s, while a Split Hopkinson Pressure Bar (SHPB) system was adopted to perform the dynamic tests for strain rates up to 5600/s. The standard Zhu-Wang-Tang (ZWT) nonlinear viscoelastic model was chosen to predict the elastic behavior of LNBR/epoxy composites under a wide range of strain rates. After some necessary derivation and data fitting, a set of model parameters for the tested materials were finally obtained. Meanwhile, the incremented form of the ZWT nonlinear viscoelastic model were deduced and implemented into the user material program of LS-DYNA. A simulation-test contrast had been performed to verify the validity and feasibility of the algorithm. The results showed that the viscoelastic behavior of epoxy resin can be
A thermosetting epoxy resin composition of one pack type is provided which contains as indispensable constituents (I) an epoxy resin containing more than one adjacent epoxy groups on the average in th
... clear, low-viscosity epoxy resin wets out reinforcement fabrics easily for layups, laminating, sealing, & vacuum bagging. No blushing means no messy wash-downs. Ideal for wood boats.
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CAS 90-72-2 25068-38-6 044 HARVEYS EPOXY PUTTY 2,4,6-tri(dimethylaminomethyl)phenol, dmp-30
bisphenol a diglycidyl ether resin, epoxy resin, epon 820, araldite
msds toxicity property
To: [email protected] Subject: Re: hull fairing From: "Kevin" [email protected] Date: Sun, 12 Sep 1999 00:28:23 -0400 Just a few facts that I know concerning the comparison of polyester resins to epoxy: Polyester is not an epoxy. It is a complete resin system that will slowly polymerize when its solvent is evaporated - though this may take months. That is why MEKP is added. It is a catalyst - not a component of the resin system - that speeds up polymerization, or curing. Epoxy is a true two-part resin system in that polymerization will not occur - over any length of time - unless the two components are mixed. Why epoxy is a better barrier coat than polyester and why epoxy doesnt blister... Epoxy is 100% solids (high quality epoxy, anyway, such as WEST, System 3, and others) meaning that there are no solvents - the lack of solvents is why epoxy resin and hardener do not have much of an odor, though some odor. The weight of cured epoxy will be the same as when it was liquid. Polyester resins ...
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Okay, so now that they are just now pulling the defibrillator off my chest from me having just heard that epoxy resin goes for at least $100 a gallon, it leaves me in aftershock. I will not mention any names of any specific ships chandlery, however, I just got off the phone with me mates over there at Best Sardine. After you stick and glue her and puddy in the epoxy paste along your seams, what are your natural alternatives, or, as you are putting fiberglass sheets and fiberglass
Epoxy resins are commonly used as laminating resins and, being valued for their strong adhesive properties and water resistance, are applied on aircraft and boats. They have been used as a primary...
Waterborne Epoxy Resin Market by Type (High Molecular Weight, Low Molecular Weight), Application (Coatings, Adhesives, and Composites), End-use Industry (Construction, Automotive, Textile, Packaging, and Furniture), and Region - Global Forecasts to 2022 ...
The research and development of epoxy resins/layered minerals nanocomposites during the last few years are summerized.In this paper the research progress about preparation and properties of EP/MMT,EP/LDH and EP/Graphite nanocomposites as three typical nanocomposites are introduced in detail.
Epoxy Resin Market in Pressure Vessels for Alternative Fuels by Vessel Type (Type II, Type III, and Type IV), by Application Type (CNG Vehicles, Hydrogen Vehicles, and Gas Transport), by Vehicle Type (Light Vehicles, Medium & Heavy Duty Commercial Vehicles, and Others), and by Region (North America, Europe, Asia-Pacific, and Rest of the World), Trend, Forecast, Competitive Analysis, and Growth Opportunity: 2017 2022
A range of laboratory tests have been conducted to assess the propensity of current epoxy resins to form blisters and establish the cause(s) of such blistering when used to line cast iron pipes. Although the results of such trials were inconclusive, the tests investigated most of the factors believed to cause blistering and demonstrated that there is no mechanism that can consistently be shown to be the cause. A Code of Practice highlighting improvements to the current regulatory documentation and instigating best working practice has been drafted, and will form the basis for a new Operational Guidelines and Code of Practice document that will be published in Autumn 2001.. ...
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The invention provides aqueous, solvent based, and solvent-free curable coating compositions which include (A) the reaction product of epoxy resin, acid, and tertiary amine; (B) reactive diluent, and, optionally, (C) curing agent. The compositions are useful for forming cured coated substrates, that are especially suitable for food and beverage packaging.
|p|Epoxy resin lab tables provide a high-density, chemical-resistant work surface ideal for biochemistry laboratories and proteomic research. Also suitable for use in general lab environments, these lab tables have a non-reactive finish and beveled edges
Epoxy-resin systems resistant to aging, molded materials and components generated from them, and their utilization. An epoxy-resin system especially suitable in the application of casting-resin methods comprising an epoxide-containing A component based on a glycidyl ether or glycidyl ester and a B component containing anhydride as a hardener is proposed, where a sterically hindered amine is added to the A component as a stabilizer to prevent aging of molded materials. Light-emitting components potted with it exhibit increased aging stability, especially as with respect to light yield over time. The epoxy-resin system can also be used for encapsulants and molding compositions, and can be blended with acrylates, for all applications, particularly in the exterior.
A layer of a liquid composition containing an epoxide resin as the sole photopolymerizable component, a heat-activated curing agent for epoxide resins, and preferably a photopolymerization catalyst, is exposed to actinic radiation until the layer solidifies to form an essentially solid, continuous film due to photopolymerization of the epoxide resin through epoxide groups, the resin remaining, however, still thermosettable by virtue of residual epoxide groups. The film so formed is contacted with fibrous reinforcing material and caused to flow about the fibers, suitably by applying heat and pressure, to form a prepreg. When desired, e.g., after the prepreg has been formed into some desired configuration or layers of prepreg have been stacked, the assembly may be cured by further heating.
Poly(ethylene glycol) diglycidyl ether (n ~13; also known as PEGDE) is a difunctional, water-soluble crosslinker for amine-, hydroxyl-, and carboxyl-functional polymers..WPE ~372Total chlorine (%): 1.9
Do not ingest epoxy resin. Do not allow epoxy resin to sit on your skin for any period of time. Do not allow epoxy resin to get into your eyes, nose or mouth. If you are sanding finished acrylic resin, use similar precautions to the molding process. If you experience difficulty breathing, dizziness or nausea, remove yourself from your work space and consult a physician. If the resin comes into contact with your body or mucous membranes, flush with water and consult a doctor ...
In this work, photoinduced orientation of three epoxy-based polymers bearing different type azo chromophores was studied. The epoxy-based azo polymers were synthesized through post-polymerization azo-
Epoxy is either any of the basic components or the cured end products of epoxy resins, as well as a colloquial name for the epoxide functional group. Epoxy resins, also known as polyepoxides, are a class of reactive prepolymers and polymers which contain epoxide groups. E
The objective of this research is to develop a test methodology to be used in determining which material properties affect the ultimate performance of a composite overwrapped pressure vessel (COPV) at liquid nitrogen (LN2) temperatures. The test methodology being evaluated is based on that used for ambient performance of COPVs and includes: resin properties, resin/fiber interface and COPV burst data. The suitability of these tests at LN2 temperatures will be evaluated. The resin properties are investigated by use of tensile tests to determine: strain to failure (%å), failure stress (óys), and elastic modulus (E). TThe objective of this research is to develop a test methodology to be used in determining which material properties affect the ultimate performance of a composite overwrapped pressure vessel (COPV) at liquid nitrogen (LN2) temperatures. The test methodology being evaluated is based on that used for ambient performance of COPVs and includes: resin properties, resin/fiber interface and ...
|p|The Loctite 420343 is a Series 1C epoxy adhesive with a mix ratio of 2.5:1.|/p||b|The Loctite 420343 Specifications: |/b||br||ul||li| Brand: Hysol®|li| Series: 1C|li| Product Type: Epoxy Adhesive|li| Material Compatibility: Ceramic, Metal, Plastic|li| Color: Part A:Off-White Part B:Green|li| Primary Color: Part A:Off-White Part B:Green|li| Mix Ratio: 2.5:1|li| Physical Form: Part A:Liquid Part B:Viscous Liquid|li| Cure Time: 24h|li| Viscosity Measurement: 350000mPa/s|li| Chemical Composition: Part A:Talc, Epoxy Resin, Titanium Dioxide, Substituted Silane, Aluminium Hydroxide Part B:Talc, Epoxy Resin/Curing Agent, Quartz (SiO2), Diethylenetriamine, 4,4-Isopropylidenediphenol, Substituted Silane, Substituted Piperazine|li| Specific Gravity: Part A:1.57 Part B:1.65|li| VOCs Content: Part A:0.13 Part B:0.57g/L|li| Odor: Part A:Negligible Part B:Ammoniacal|li| Cure Type: Room 77°F|li| Container Capacity: 17lb|li| Container Type: Kit|li| Applications: Bonding, General Purpose|li| Package Quantity: 2CA|
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