• The researchers believe the technique could also be used to connect multi-layered graphene to metal contacts, though their published research has so far focused on carbon nanotubes. (ecnmag.com)
  • To make it scalable for manufacturing, they also worked toward technologies for isolating and aligning individual carbon nanotubes between the metal terminals on a silicon substrate, and for examining the properties of the resulting structures. (ecnmag.com)
  • Using a new method for precisely controlling the deposition of carbon, researchers have demonstrated a technique for connecting multi-walled carbon nanotubes to the metallic pads of integrated circuits without the high interface resistance produced by traditional fabrication techniques. (ecnmag.com)
  • By using an external series resistance during dielectrophoresis, higher than the contact resistance of the carbon nanotube obtained after dielectrophoresis, we are able to limit the deposition to individual nanotubes. (epfl.ch)
  • This opens doors to easily study individual nanotubes and to integrate CNT based devices in CMOS technology. (epfl.ch)
  • Based on electron beam-induced deposition (EBID), the work is believed to be the first to connect multiple shells of a multi-walled carbon nanotube to metal terminals on a semiconducting substrate, which is relevant to integrated circuit fabrication. (ecnmag.com)
  • Prior to deposition, the ends of the nanotubes are opened using an etching process, so the deposited carbon grows into the open end of the nanotube to electronically connect multiple shells. (ecnmag.com)